The launch-schedule for these processors will be spread throughout 2009.Īfter RV740, the next AMD venture on the 40nm silicon process will be the company's next flagship GPU: the RV790. At some point within the succession, AMD will crank up the HyperTransport interconnect speed from 1,800 MHz to 2,000 MHz. Despite the high clock speeds, the chips will continue to maintain rated TDPs of 125W. With the Phenom II X4 950 being clocked at 3.10 GHz, succeeding SKUs take 100 MHz steps, starting from a Phenom II X4 960 at 3.20 GHz to a Phenom II X4 990 at 3.50 GHz. This according to the insider sources a German website called AMD News caught up with.Īll the upcoming processors will be built on the AM3 package, making them compatible with DDR3 and DDR2 memory standards. With the AM2+ exclusive Phenom II X4 940 already showing impressive overclocking potential, while shipping with a clock speed of 3.00 GHz, the company is planning to increase stock clock speeds in increments of 100 MHz (0.5x multiplier) with a string of SKUs post Phenom II X4 950. Scythe is expected to announce this cooler soon.īeating its chest on the "massive headroom" (read: clock speed increment potential) its newest line of processors, the Phenom II have, it was about time the company utilized the said headroom to carve out new SKUs. The Katana III is compatible with all standard desktop sockets including Intel LGA-1366, LGA-775 and AMD AM2(+)/AM3. Accordingly, its noise levels range between 7.2 and 31.07 dBA. It makes use of a single 92mm PWM-controlled fan that rotates at speeds between 300 and 2,500 rpm to push 6.7 to 55.5 CFM of air. The cooler measures 143mm × 108mm × 94mm and weighs 495g (1.09 lbs). This design is somewhat similar to that of the Gelid Silent-Spirit except for that the latter makes a more acute angle with the plane of the motherboard. These heatpipes convey heat to the fin array. ![]() A CPU contact block that doubles up as a small heatsink, forms are a starting-point, rather than mid-point of six copper heatpipes. It sports a strange, audacious yet familiar design: an aluminum-fin array propagating diagonally. ![]() The cooler seems to have been designed keeping the latest Core i7 and Phenom II processors in mind. After rescheduling the launch, it could arrive by March.Īfter a host of new CPU coolers rolling out of Scythe's stables, the latest one in the making is the Katana III. ![]() The Arandale core was originally slated for "back to school" season, 2010 (around September~October). Arandale from all that is known thus far is the dual-core Nehalem implementation on 32nm lithography, apart from speculation of it holding a higher amount of 元 cache: possibly 6 MB against 4 MB on the Havendale/Auburndale. Arandale features in the future series of Nehalem-derived processors to be built on the 32nm high-K silicon process, slated for 2010. Instead, Intel is working to push forward the launch of their common successor by six months: the Arandale core. The two were set to make possible Intel Core i4 and i3 SKUs. Theo Valich, noted industry commentator, in his latest blog post in Theo's Bright Side of IT, mentions that Intel scrapped Havendale and Auburndale in its conceived form. The "MCM" (multi-chip module) part comes to light in the way the chips were originally conceived: two dice on a package, one holding the CPU complex and the other holding the northbridge, consisting of a memory controller, PCI-Express root complex, and a graphics controller. Company roadmaps originally pointed at two chips, codenamed Havendale and Auburndale to be the dual-core MCM implementations of the Nehalem architecture, for desktops and notebooks respectively. Grappling with a deteriorating world economy, and overstocked inventories with current-generation Core 2 platforms, Intel seems to have had a change of plans with regards to its dual-core Nehalem-derivatives.
0 Comments
Leave a Reply. |
AuthorWrite something about yourself. No need to be fancy, just an overview. ArchivesCategories |